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Our Products
- Reduce by solder problem of poor contact
- Ensure that the substrate FG strengthen the reliability of the contact portion
- Prevent machine vibration to increase screws relaxation
- EIA standardized package, improve production efficiency
- Reduce by solder problem of poor contact
- Alloy Foil over Retardant Urethane Foam
- Low surface resistance and abrasion resistance
- Effective ESD solutions and excellent EMI shielding
- High compression resistance and is not deformed or broken advantages
- Alloy Foil over Retardant Urethane Foam
- Alloy Foil over Retardant silicone rubber
- Low surface resistance and abrasion resistance
- Effective ESD solutions and excellent EMI shielding
- High compression resistance and is not deformed or broken advantages
- Alloy Foil over Retardant silicone rubber
- Cheap and reduce the work circle time
- Normalized design, reduce product design time
- Superior mechanical properties, suitable for a variety of purposes
- EIA standardized package, improve production efficiency
- Cheap and reduce the work circle time
- Low DC resistance and high shielding effectiveness
- After accelerated life test has excellent reliability (ALT)
- Good high compression percentage and lower compressive force
- Reducing the fixed point, adding more space function
- Low DC resistance and high shielding effectiveness
- KPGB Series-Black Color (Surface Treatment: Anti Tarnish Urethane Coated= ATU). High compression conductive PU foam mixed with Tin.
- Low DC resistance and high shielding effectiveness
- After accelerated life test has excellent reliability (ALT)
- KPGB Series-Black Color (Surface Treatment: Anti Tarnish Urethane Coated= ATU). High compression conductive PU foam mixed with Tin.
- Low DC resistance and high shielding effectiveness
- After accelerated life test has excellent reliability (ALT)
- Good high compression percentage and lower compressive force
- PE material air cushion, good wear resistance
- Low DC resistance and high shielding effectiveness
- Most be reliable electrostatic solutions and excellent electromagnetic protection
- Superior conductivity and compression resilience force
- Can offer many kinds of size and shape and provide customized request
- Can provide various types of EMI Shielding I/O gasket
- Most be reliable electrostatic solutions and excellent electromagnetic protection
- Effective electrostatic solution and excellent EMI and RFI shielding
- Available in a variety of sizes and shapes, it can also be combined with different specifications of insulating film or adhesive and can be widely used in any electronic product
- Effective electrostatic solution and excellent EMI and RFI shielding
- Easy die cut and adhesive for other materials, increased functionality
- Not adhesive residue, easy processing
- Good contact with both hard and soft surfaces
- X-Y-Z axis conduction direction with excellent conductive properties
- Easy die cut and adhesive for other materials, increased functionality
- Our Copper Foil Tapes can be able to use in RFI and EMI shielding applications of the electrical and electronic products.
- Our Copper Foil Tapes can be able to designed for use in applications where electrical or thermal conductivity is required and can be soldering
- Our Copper Foil Tapes can be able to use in RFI and EMI shielding applications of the electrical and electronic products.
- Our Aluminum Foil Tapes can be able to use in RFI and EMI shielding applications of the electrical and electronic products.
- Our Aluminum Foil Tapes can be able to designed for use in applications where electrical or thermal conductivity is required and cheaper.
- Our Aluminum Foil Tapes can be able to use in RFI and EMI shielding applications of the electrical and electronic products.
- Can be based on customer demand for design, punching or processed into desired size
- Can be used with any combination of material to meet the problem occurs between the conductive and insulating
- The mold speed is fast and simple knife, punching processing to send samples fast
- The die-cut of top technology, tolerance coefficient is extremely small, good quality
- Can be based on customer demand for design, punching or processed into desired size
- EMI absorber materials can be solutions that can be applied when there is no time to do major redesigning of the board layout.
- EMI absorber materials can be able to convert EMI noise into negligible heat energy.
- They work effectively at various frequency ranges from the KHz and MHz range up to the higher GHz range. With non-conductive adhesive on one side.
- They can be easily applied directly over ICs, CPUs, graphic chips, and even cables without fear of short-circuiting.
- EMI absorber materials can be solutions that can be applied when there is no time to do major redesigning of the board layout.
- Customer can choose different material (Be-Cu / Pb-Cu / Ti-Cu / SUS301/ SUS304....) and plating metal layer (Bright Nickel / Matte Nickel / Sn / Au....)
- Nearly 200 kinds of size and shape to choose from, saving the time and expense of the mold, and provide customized needs from all customer.
- Customer can choose different material (Be-Cu / Pb-Cu / Ti-Cu / SUS301/ SUS304....) and plating metal layer (Bright Nickel / Matte Nickel / Sn / Au....)
- Extensive selection of conductive and shielding fabrics.
- Variations of corrosion resistance, weight, color, bio-compatibility. Solid weaves, meshes, knit and non-woven available.
- Smart textiles need to be highly conductive and can transmit physiological signals to the sensing element, Conductivity comes from conductive textiles.
- Extensive selection of conductive and shielding fabrics.
